Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
- Author
- Kim S. Siow
- Publisher
- Springer International Publishing
- Language
- English
- Edition
- 1st ed.
- Year
- 2019
- Page
- XX, 279
- ISBN
- 978-3-319-99255-6,978-3-319-99256-3
- File Type
- pdf
- File Size
- 12.3 MiB
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