Modeling and Application of Flexible Electronics Packaging
- Author
- YongAn Huang, Zhouping Yin, Xiaodong Wan
- Publisher
- Springer Singapore
- Language
- English
- Edition
- 1st ed.
- Year
- 2019
- Page
- XVII, 287
- ISBN
- 978-981-13-3626-3;978-981-13-3627-0
- File Type
- pdf
- File Size
- 14.5 MiB
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