Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
- Author
- Hengyun ZhangFaxing CheTingyu LinWensheng Zhao
- Publisher
- Woodhead Publishing
- Language
- English
- Year
- 2019
- Page
- 434
- ISBN
- 0081025327,9780081025321
- File Type
- pdf
- File Size
- 18.8 MiB
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