Advances in embedded and fan-out wafer level packaging technologies
- Author
- Keser, BethKroehnert, Steffen
- Publisher
- Wiley-IEEE Press
- Language
- English
- Year
- 2019
- Page
- (xxvii, 548 pages) : illustrations en partie en couleur
- ISBN
- 9781119313977,9781119313984,9781119314134,111931397X,1119313988,9781119313991,1119313996
- File Type
- pdf
- File Size
- 29.3 MiB
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