3D Microelectronic Packaging: From Architectures to Applications
- Author
- Yan Li, Deepak Goyal
- Publisher
- Springer Singapore;Springer
- Language
- English
- Edition
- 2nd ed.
- Year
- 2021
- Page
- XVII, 622
- ISBN
- 9789811570896,9789811570902
- File Type
- pdf
- File Size
- 35.4 MiB
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